EDAL ELECTRONICS CO., LTD.

2009-01-06	Power Integrations发布最新版电源设计软件 — PI Expertä Suite v7.1
2008-10-28	BCR40x-series product brief
2008-10-28	BCR450 High Precision Controller for High Brightness LEDs
2008-09-11	Power Integrations的EcoSmart®技术已节省30多亿美元的能源费用
2008-08-14	STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard
2008-07-30	Power Integrations再次推出新的TOPSwitch®-HX系列離線式開關IC，可實現極其緊湊和輕巧的筆記本適配器的設計
2008-07-28	Infineon Power Module Runs Chang An Jiexun Hybrid Electrical Vehicles to be Used at Beijing Olympic Games
2008-07-28	Infineon Introduces Low Noise Amplifier with Best-in-Class Noise Figure for GPS Applications
2008-07-16	Infineon Introduces Single Chip Multi-Band UHF Transmitter Family with Integrated 8-bit Microcontroller; SmartLEWIS™ MCU Family Addresses Wide Range of Wireless Control Applications
2008-07-16	Infineon Announces World’s First DSL CPE Solution Supporting Concurrent Erasure Decoding and Retransmission for High Quality IPTV; Also Extends Interoperability Performance
2008-07-05	Infineon Introduces World’s First 1.8V Broadband Low Noise Amplifier to Support Portable TV and Mobile TV Systems
2008-07-05	New Infineon RF Power Transistors Offer Highest Peak Power in 700 MHz Band
2008-07-05	Infineon Announces Industry’s First High-Performance LDMOS RF Power Transistors in Copper-Based Open-Cavity Plastic Packages for RoHS-Compliant Designs
2008-07-05	Infineon Introduces World’s Highest Integrated VoIP Solution for Next Generation Access Applications
2008-06-27	Power Integrations - LinkSwitch®-II Presentation
2008-06-23	Power Integrations - LinkSwitch®-II
2008-05-29	Infineon Introduces New OptiMOS 3 MOSFETs Featuring World’s Lowest On-State Resistance in SuperSO8 Leadless Packages; Increases Power-Density up to 50 Percent in Industrial, Consumer, Telecommunications Applications
2008-05-29	Infineon Introduces MIPAQ Family of Power Modules Integrating Power, Application and Quality
2008-05-24	Infineon Introduces DECT 6.0 / CAT-iq Chipset with Texas Instruments’ Puma 5 DOCSIS 3.0 Cable Modem Solution
2008-04-09	NXP Semiconductors introduces four new 32-bit ARM9 microcontrollers
2008-04-09	NXP Launches World’s Smallest Single-chip Triple-mode PCTV Solution
2008-03-15	New Infineon MOSFET Families Reduce Power Losses by up to 30 Percent in Industrial, Consumer, Telecommunications Applications
2008-01-21	NXP Powers Sling Media’s New SlingCatcher Set Top Box
2008-01-21	NXP Delivers World's First USB Battery Charger Detection Solution to Intelligently Charge Mobile Phones
2008-01-09	Low Cost LED Drivers for General Lighting
2008-01-09	BGA615L7 Silicon Germanium GPS LNA MMIC
2008-01-09	ESD Protection Diodes for High-Speed Applications
2008-01-09	Infineon - SMM310 Silicon MEMS Microphone
2007-11-23	NXP introduces new silicon based solution for today’s mobile trends
2007-11-23	NXP Innovation Brings SDR Technology to Address Mobile Communication Standards
2007-10-25	NXP shines in world’s first solar cellphone from Hi-Tech Wealth
2007-10-25	NXP’s Wireless USB Chip receives USB-IF Certification
2007-10-13	Infineon Signs Agreement with Motorola to Develop 3G Radio Frequency Chip
2007-10-13	Infineon’s AMAZON-SE ADSL2/ 2+ System-On-a-Chip Wins IEC 2007 InfoVision Award in “Enabling Silicon and Component-Level Technologies” Category